12/15

Part No. : LTPL-C0675WPNB

BNS-OD-FC002/A4

SMD LED

LTPL-C0675WPNB

7. Cautions

7.1 Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,

communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications

in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize

life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety

devices).

7.2 Storage

This product is qualified as Moisture sensitive Level 3 per JEDEC J-STD-020 Precaution when handing this moisture

sensitive product is important to ensure the reliability of the product.

The package is sealed:

The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within

one year, while the LEDs is packed in moisture-proof package with the desiccants inside.

The package is opened:

The LEDs should be stored at 30°C or less and 60%RH or less. Moreover, the LEDs are limited to solder process within

168hrs. If the Humidity Indicator shows the pink color in 10% even higher or exceed the storage limiting time since

opened, that we recommended to baking LEDs at 60°C at least 48hrs. To seal the remainder LEDs return to package, it

’s

recommended to be with workable desiccants in original package.

7.3 Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

7.4 Soldering

Recommended soldering conditions:

Reflow soldering

Soldering iron

Pre-heat

Pre-heat time

Peak temperature

Soldering time

150~200°C

120 sec. Max.

260°C Max.

10 sec. Max.(Max. two times)

Temperature

Soldering time

300°C Max.

3 sec. Max.

(one time only)

Notes:

Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit

boards, no single temperature profile works for all possible combinations. However, you can successfully mount your

packages to the PCB by following the proper guidelines and PCB-specific characterization.

LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.

The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on

JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page2 shows

a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your

reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the

solder paste manufacturer to avoid damaging the device and create a reliable solder joint.