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LDS8846 Datasheet(PDF) 8 Page - IXYS Corporation |
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LDS8846 Datasheet(HTML) 8 Page - IXYS Corporation |
8 / 12 page ![]() LDS8846 © 2009 IXYS Corp. 8 Doc. No. 8846DS, Rev. N1.6 Characteristics subject to change without notice Recommended Layout It is recommended to minimize trace length to decoupling capacitors. A ground plane should cover the area under the driver IC as well as the bypass capacitors. Short connection to ground on capacitors CIN and COUT can be implemented with the use of multiple vias. A copper area matching the TQFN exposed pad (PAD) must be connected to the ground plane underneath. The use of multiple via improves the package heat dissipation. Figure 6. LDS8846 Recommended layout |
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