DFNW10, 3x3, 0.5P

CASE 507AE

ISSUE A

DATE 15 JUN 2018

SCALE 2:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30mm FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. THIS DEVICE CONTAINS WETTABLE FLANK

DESIGN FEATURE TO AID IN FILLET FORMA-

TION ON THE LEADS DURING MOUNTING.

A

B

E

D

D2

E2

BOTTOM VIEW

b

e

10X

0.10

B

0.05

A

C

PIN ONE

REFERENCE

TOP VIEW

A

A3

0.05 C

0.05 C

C

SEATING

PLANE

SIDE VIEW

L

10X

1

5

6

10

1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

DETAIL B

DETAIL A

NOTE 4

GENERIC

MARKING DIAGRAM*

XXXXX = Specific Device Code

A

= Assembly Location

L

= Wafer Lot

Y

= Year

W

= Work Week

G

= Pb−Free Package

XXXXX

XXXXX

ALYW

G

G

1

(Note: Microdot may be in either location)

SOLDERING FOOTPRINT*

10X

0.58

3.30

1.75

0.30

1

0.50

PITCH

3.30

10X

DIMENSIONS: MILLIMETERS

2.50

0.50

PITCH

PACKAGE

OUTLINE

b2

4X

DIM

MIN

NOM

MILLIMETERS

A

0.80

0.90

A1

−−−

−−−

b

0.20

0.25

D

D2

2.30

2.40

E

E2

1.55

1.65

e

0.50 BSC

L

0.30

0.40

A3

0.20 REF

2.90

3.00

K

A4

L3

MAX

2.90

3.00

1.00

0.05

0.30

2.50

1.75

0.50

3.10

3.10

ALTERNATE

CONSTRUCTION

DETAIL A

L3

SECTION C−C

PLATED

A4

SURFACES

L3

L3

L

DETAIL B

PLATING

EXPOSED

ALTERNATE

CONSTRUCTION

COPPER

A4

A1

A4

A1

L

e

b2

4X

0.28

C

C

0.25 REF

0.28 REF

0.05 REF

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “

G”,

may or may not be present. Some products

may not follow the Generic Marking.

0.10

−−−

−−−

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

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disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON17793G

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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DFNW10 3x3, 0.5P

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