NCV30161

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3

MAXIMUM RATINGS

Rating

Symbol

Min

Max

Unit

VIN to GND

VIN

−0.3

40

V

Driver Output Voltage to GND

GATE

−0.3

6.5

V

VCC to GND

VCC

−0.3

6

V

DIM/EN to GND

DIM

−0.3

6

V

CS to GND

CS

−0.3

6

V

ROT to GND

ROT

−0.3

6

V

Absolute Maximum junction temperature

150

°C

Operating Junction Temperature Range

TJ

−40

125

°C

Storage Temperature Range

−55 to +125

°C

Thermal Characteristics

DFN10 3x3 Plastic Package

PD

1.46

W

Thermal Resistance Junction−to−Ambient (Note 2)

86

°C/W

Lead Temperature Soldering (10 sec):

Reflow (SMD styles only) Pb−Free (Note 3)

TL

260

°C

Moisture Sensitivity Level (Note 4)

MSL

1

−

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. The maximum package power dissipation limit must not be exceeded.

3. 60−180 seconds minimum above 237°C.

4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.