Surface Mount LED

TLGE1005B

Features

3.2 (L) x 2.4 (W) x 2.4 (H) mm

2 mm lens top type

InGaAlP LED

Reflow soldering is possible

Standard embossed taping 4 mm pitch : T03 (1000 pcs/reel)

Applications

High−output backlighting source

Battery−powered equipment

Message boards

Portable devices

Computer peripherals

Maximum Ratings (Ta=25

o

C)

Characteristic

Symbol

Max.

Unit

Forward Current

25

mA

Reverse Voltage

4.00

V

Power Dissipation

60.00

mW

Operating Temperature

−40 ~ 85

o

C

Storage Temperature

−40 ~ 100

o

C

Soldering Temperature

260

o

C

Soldering Time

−

for 3 sec. max

−

Opto−Electrical Characteristics (Ta=25

o

C)

Characteristic

Symbol Test Condition

Min

Typ

Max Unit

Forward Voltage

−

2.00 2.40

V

Reverse Current

−

−

50

µA

Luminous Intensity

153.00 350.00

− mcd

Viewing Angle

2

−

−

45

o

− deg.

Peak Wavelength

λp

−

574

− nm

Dominant Wavelength

λd

−

571

− nm

Spectral Line Half Width

∆λ

−

11

− nm

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