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STM32G0 Datasheet(PDF) 109 Page - STMicroelectronics |
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STM32G0 Datasheet(HTML) 109 Page - STMicroelectronics |
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109 / 135 page ![]() DS12232 Rev 4 109/135 STM32G071x8/xB Package information 129 Figure 33. Recommended PCB pad design for WLCSP25 package Table 74. WLCSP25 mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 3 decimal digits. Min Typ Max Min Typ Max A(2) 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal values and tolerances of A1 and A2. - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3 - 0.025(3) 3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process capability. -- 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 2.28 2.30 2.32 0.090 0.091 0.091 E 2.46 2.48 2.50 0.097 0.098 0.098 e - 0.40 - - 0.016 - e1 - 1.60 - - 0.063 - e2 - 1.60 - - 0.063 - F(4) 4. Calculated dimensions are rounded to the 3rd decimal place - 0.350 - - 0.014 - G(4) - 0.440 - - 0.017 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 MS18965V2 Dsm Dpad |
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