OPA622AP datasheet(4/18 Pages) BURR-BROWN

Part #	OPA622AP

Description	Wide-Bandwidth OPERATIONAL AMPLIFIER

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Manufacturer	BURR-BROWN [Burr-Brown (TI)]

Direct Link	http://www.burr-brown.com

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OPA622

4

®

PAD

FUNCTION

1

Quiescent Current Adjustment

2

Inverting Analog Input

3

Non-Inverting Analog Input

4NC

5NC

6

–5V Supply

7

–5V Supply, Output

8

Inverting Buffer Output

9

Analog Output

10

Analog OTA Output

11

+5V Supply, Output

12

+5V Supply

13

Non-Inverting Buffer Output

Substrate Bias: Negative Supply

NC: No Connection

Wire Bonding: Gold wire bonding is recommended.

DICE INFORMATION

MECHANICAL INFORMATION

MILS (0.001")

MILLIMETERS

Die Size

57 x 69

±5

1.44 x 1.76

±0.13

Die Thickness

14

±1

0.55

±0.025

Min. Pad Size

4 x 4

0.10 x 0.10

Backing: Titanium

0.02+0.05,–0.0

0.0005+0.0013, –0.0

Gold

0.30

±0.05

0.0076

±0.0013

OPA622AD DIE TOPOGRAPHY

PIN NO.

DESCRIPTION

FUNCTION

1

NC

No Connection

2IQ Adjust

Quiescent Current Adjustment; typical 3-8mA

3

–In

Inverting Analog Input

4

+In

Noninverting Analog Input

5–VCC

Negative Supply Voltage; typical –5VDC

6–VCC OUT

Negative Supply Voltage Output Buffer;

typical –5VDC

8

BUF–

Analog Output Feedback Buffer

9VOUT

Analog Output

10

OTA

Analog Output OTA

11

+VCC OUT

Positive Supply Voltage Output Buffer; typical

+5VDC

12

+VCC

Positive Supply Voltage; typical +5VDC

13

BUF+

Analog Output/Input

14

NC

No Connection

PIN CONFIGURATION

FUNCTIONAL DESCRIPTION

NC

I

Q Adjust

–In

+In

–V

CC

–V

CC OUT

NC

BUF+

+V

CC

+V

CC OUT

OTA

V

OUT

BUF–

1

2

3

4

5

6

7

OPA622

14

13

12

11

10

9

8

FB

OTA

OB

13

4

10

3

512

2

Biasing

11

6

8

SO/DIP

9

Top View

ELECTROSTATIC

DISCHARGE SENSITIVITY

Electrostatic discharge can cause damage ranging from per-

formance degradation to complete device failure. Burr-

Brown Corporation recommends that all integrated circuits

be handled and stored using appropriate ESD protection

methods.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet

published specifications.

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