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STM32L011E4 Datasheet(PDF) 110 Page - STMicroelectronics |
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STM32L011E4 Datasheet(HTML) 110 Page - STMicroelectronics |
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110 / 119 page ![]() Package information STM32L011x3/4 110/119 DocID027973 Rev 5 Figure 48. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package footprint 1. Dimensions are expressed in millimeters. k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Table 73. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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