Top Mount Chip LED

B1911NG--20D-004314

Official Product

HT Part No. B1911NG--20D-004314

Tentative Product

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Specifications are subject to change without notice. Data and

drawings herein are copyrighted.

11/19/2019

Version 1.0

Page

13/14

Reflow Soldering

Recommend soldering paste specifications:

1. Operating temp.: Above 217℃ ,60~150 sec.

2. Peak temp.:260℃Max.,10sec Max.

3. Reflow soldering should not be done more than two times.

4. Never attempt next process until the component is cooled down to room temperature after

reflow.

5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as

following:

Reworking

 Rework should be completed within 5 seconds under 260 OC.

 The iron tip must not come in contact with the copper foil.

 Twin-head type is preferred.

Cleaning

Following are cleaning procedures after soldering:

 An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.

 Temperature x Time should be 50oC x 30sec. or <30oC x 3min

 Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter

 Curing: 100 OC max, <3min