Top Mount RGB Chip LED

B39P3RGB-F6

Official Product

HT Part No. B39P3RGB-F6

Customer Part No.

Data Sheet No.

Tentative Product

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Specifications are subject to changes for improvement without

advance notice. Proprietary data, drawings, company confidential

all rights reserved.

13/04/2018

Version 1.0

Page

5/19

Others:

Each immediate box consists of 28 reels. The 28 reels may not necessarily have the same lot number or the same bin

combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product

label.

(每一中箱有 28 捲捲帶，28 捲的捲帶不一定有一致的亮度、波長、順向偏壓或是批號。每一份捲帶都有其標籤定

義出規格)

Note :This is shipped test conditions

(註：此為出廠檢驗條件)

※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product,

such operation can cause migration resulting in LED damage.

(※備註：產品應於順向偏壓下操作，假如長期使用於逆向偏壓下可能形成電致遷移導致 LED 損壞。)

ATTENTION: Electrostatic Discharge (ESD) protection

(注意！！靜電放電保護)

The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based

chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts

built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be

taken during design and assembly.

If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.

(左圖為須做靜電保護標誌。晶片中磷化鎵和砷化鋁鎵即便是在有相當安全的靜電放電的措施下，對於 ESD 的

保護還是必要的。建構於磷化鋁銦鎵、氮化鎵或氮化銦鎵的晶片都是靜電敏感元件。在設計與組件中作的靜電保

護都是必須的。

假設人工作業程序是必須的，須確保設備製程是擁有靜電保護的程序)