Top Mount RGB Chip LED

B39P3RGB-F6

Official Product

HT Part No. B39P3RGB-F6

Customer Part No.

Data Sheet No.

Tentative Product

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Specifications are subject to changes for improvement without

advance notice. Proprietary data, drawings, company confidential

all rights reserved.

13/04/2018

Version 1.0

Page

2/19

DISCLAIMER 免責聲明 ....................................................................................................................3

PRODUCT SPECIFICATIONS 產品規格 ...............................................................................................4

ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION 靜電放電保護 .................................................5

LABEL SPECIFICATIONS 標籤規格.....................................................................................................6

SPECIFICATIONS RANGE 規格範圍 ...................................................................................................8

PRODUCT FEATURES 產品特色 ........................................................................................................9

ELECTRO-OPTICAL CHARACTERISTICS 光學特性..........................................................................................9

PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW SOLDERING 封裝外形尺寸與建

議的焊盤尺寸

.....................................................................................................................................9

ABSOLUTE MAXIMUM RATINGS 絕對最大額定值 .................................................................................. 10

CHARACTERISTICS OF B39P3RGB-F6 ..................................................................................................... 11

PRECAUTION FOR USE 使用注意事項 ............................................................................................ 13

PACKAGING 包裝........................................................................................................................... 14

TAPE DIMENSION 捲帶尺寸................................................................................................................ 14

REEL DIMENSION 捲盤尺寸................................................................................................................ 15

PACKING 包裝方式 .......................................................................................................................... 15

DRY PACK 乾燥包裝方法 ............................................................................................................... 16

BAKING 烘烤 ................................................................................................................................... 16

PRECAUTIONS 注意事項................................................................................................................ 17

REFLOW SOLDERING 迴流焊.......................................................................................................... 17

REWORKING 重工 ............................................................................................................................. 18

CLEANING 清潔 ................................................................................................................................ 18

REVISE HISTORY 修改記錄 ................................................................................................................. 19