Side View Chip LED

B12F1IR--50C-000174

Official Product

HT Part No. B12F1IR--50C-000174

Tentative Product

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Specifications are subject to changes for improvement without advance notice.

Proprietary data, drawings, company confidential all rights reserved.

02/20/2020

Preliminary

Page 13/14

Reflow Soldering

Recommend soldering paste specifications:

1.

Operating temp.: Above 220℃ ,60sec

2.

Peak temp.:260℃ Max.,10sec Max.

3.

Reflow soldering should not be done more than two times.

4.

Never take next process until the component is cooled down to room temperature after

reflow.

5.

The recommended reflow soldering profile (measuring on the surface of the LED terminal)

is following:

Lead-free Solder Profile

Reworking

 Rework should be completed within 5 seconds under 260℃.

 The iron tip must not come in contact with the copper foil.

 Twin-head type is preferred.

Cleaning

Following are cleaning procedures after soldering:

 An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.

 Temperature x Time should be 50℃ x 30sec. or <30℃ x 3min

 Ultra sonic cleaning: < 15W/ bath; bath volume ≤ 1liter

 Curing: 100℃ max, <3min