56F8335 datasheet(159/160 Pages) FREESCALE

159 / 160 page

Thermal Design Considerations

56F8335 Technical Data, Rev. 5

Freescale Semiconductor

159

Preliminary

Figure 11-3 128-pin LQFP Mechanical Information

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE H IS LOCATED AT BOTTOM OF LEAD

AND IS COINCIDENT WITH THE LEAD WHERE THE

LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF

THE PARTING LINE.

4. DATUMS A, B, AND D TO BE DETERMINED AT DATUM

PLANE H.

5. DIMENSIONS D AND E TO BE DETERMINED AT

SEATING PLANE C.

6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER

SIDE. DIMENSIONS D1 AND E1 DO INCLUDE MOLD

MISMATCH AND ARE DETERMINED AT DATUM

PLANE H.

7. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL NOT

CAUSE THE b DIMENSION TO EXCEED 0.35.

DIM

MILLIMETERS

MIN

MAX

---

1.60

0.05

0.15

1.35

1.45

0.17

0.27

0.17

0.23

0.09

0.20

0.09

0.16

22.00 BSC

20.00BSC

0.50 BSC

16.00 BSC

14.00 BSC

0.45

0.75

1.00 REF

0.50 REF

0.20

---

0.08

---

0.08

0.20

---

11o

13o

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