Microsemi

Linfinity Microelectronics Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 10

Copyright

© 2000

Rev. 1.1b, 2005-03-03

LX1992

High Efficiency LED Driver

TM

®

PACKAGE DI MENSI ONS

DU

8-Pin Miniature Shrink Outline Package (MSOP)

N

L

P

K

M

B

D

G

H

C

A

Dim

MIN

MAX

MIN

MAX

A

2.85

3.05

.112

.120

B

2.90

3.10

.114

.122

C

–

1.10

–

0.043

D

0.25

0.40

0.009

0.160

G

0.65 BSC

0.025 BSC

H

0.38

0.64

0.015

0.025

J

0.13

0.18

0.005

0.007

K

0.95 BSC

0.037 BSC

L

0.40

0.70

0.016

0.027

M

3°

3°

N

0.05

0.15

0.002

0.006

P

4.75

5.05

0.187

0.198

LM

8-Pin Plastic MLP-Micro Exposed Pad

e

D

E

b

A3

Internally Connected

together, but isolated

from all other terminals

L2

L2

D2

E2

L

A2

A

A1

K

Θ

Dim

MIN

MAX

MIN

MAX

A

0.80

1.00

0.031

0.039

A1

0.00

0.05

0.000

0.002

A2

0.65

0.75

0.025

0.029

A3

0.15

0.25

0.005

0.009

b

0.28

0.38

0.011

0.015

D

2.90

3.10

0.114

0.122

E

2.90

3.10

0.114

0.122

e

0.65 BSC

0.025 BSC

D2

1.52

2.08

0.060

0.082

E2

1.02

1.31

0.040

0.052

K

0.20

*

0.008

*

L

0.20

0.60

0.008

0.023

L2

0

0.13

0

0.005

Θ

0°

12°

0°

12°

Note:

1. Dimensions do not include mold flash or

protrusions;

these

shall

not

exceed

0.155mm(.006”) on any side.

Lead dimension

shall not include solder coverage.