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LX1992 Datasheet(PDF) 2 Page - Microsemi Corporation

Part # LX1992
Description  High Efficiency LED Driver
Download  11 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

LX1992 Datasheet(HTML) 2 Page - Microsemi Corporation

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Microsemi
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
© 2000
Rev. 1.1b, 2005-03-03
LX1992
High Efficiency LED Driver
PRODUCTION DATA SHEET
TM
®
ABSOLUTE MAXI MUM RATI NGS
Supply Voltage (VIN) ........................................................................-0.3V to 7.0V
Feedback Input Voltage (VFB) ................................................-0.3V to VIN + 0.3V
Shutdown Input Voltage (V
SHDN) ...........................................-0.3V to VIN + 0.3V
Analog Adjust Input Voltage (VADJ).......................................-0.3V to VIN + 0.3V
Source Input Current (ISRC).................................................................... 0.80 ARMS
Operating Junction Temperature.................................................................. 150°C
Storage Temperature Range...........................................................-65°C to 150°C
Lead Temperature (Soldering 180 seconds) ................................................ 235°C
Peak Package Solder Reflow Temp. (40 second max. exposure) ... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
TH ERM A L DATA
DU
Plastic MSOP 8-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θJA
206
°C/W
THERMAL RESISTANCE
-JUNCTION TO CASE,
θJC
39
°C/W
LM
Plastic MLP 8-Pin
THERMAL RESISTANCE
-JUNCTION TO AMBIENT,
θJA
41
°C/W
THERMAL RESISTANCE
-JUNCTION TO CASE,
θJC
5.2
°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
PACKAGE PIN OUT
1
2
4
3
5
6
8
7
DRV
FB
IN
GND
SRC
CS
ADJ
DU PACK AGE
(Top View)
SHDN
4
3
2
1
5
6
7
8
LM P ACKAGE
(Top View)
DRV
FB
IN
SHDN
SRC
CS
GND
ADJ
RoHS / Pb-free 100% Matte Tin Lead Finish
FUNCTIONAL PIN DESCRIPTION
NAME
DESCRIPTION
IN
Unregulated IC Supply Voltage Input – Input range from +1.6V to 6.0V. Bypass with a 1µF or greater capacitor
for operation below 2.0V.
FB
Feedback Input – Connects to a current sense resistor between the output load and GND to set the output
current.
SHDN
Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to 0.2µA (Typ).
Connect SHDN to VCC for normal operation.
DRV
MOSFET Gate Driver – Connects to an external N-Channel MOSFET.
CS
Current-Sense Amplifier Input – Connecting a resistor between CS and GND sets the peak inductor current limit.
GND
Common terminal for ground reference.
ADJ
Adjustment Signal Input – Provides the internal reference, via an internal filter and gain resistor, allowing a
dynamic output current adjustment corresponding to a varying duty cycle. The actual ADJ pin voltage range is
from VIN to GND. In order to minimize the current sense resistor power dissipation a practical range of VADJ =
0.0V to 0.5V should be used.
SRC
MOSFET Current Sense Input - Connects to the External N-Channel MOSFET Source.
Note: ADJ pin should not be left floating.


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