TMP86FS64FG datasheet(247/252 Pages) TOSHIBA

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Page 235

TMP86FS64FG

22.7 Recommended Oscillating Conditions

Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these factors are

greatly affected by board patterns, please be sure to evaluate operation on the board on which the device will actually be

mounted.

Note 2: When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend

electrically shielding the package in order to maintain normal operating condition.

Note 3: The product numbers and specifications of the resonators by Murata Manufacturing Co., Ltd. are subject to change. For

up-to-date information, please refer to the following URL:

http://www.murata.com

22.8 Handling Precaution

- The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown

below.

1. When using the Sn-37Pb solder bath

Solder bath temperature = 230

°C

Dipping time = 5 seconds

Number of times = once

R-type flux used

2. When using the Sn-3.0Ag-0.5Cu solder bath

Solder bath temperature = 245

°C

Dipping time = 5 seconds

Number of times = once

R-type flux used

Note: The pass criteron of the above test is as follows:

Solderability rate until forming

≥ 95 %

- When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend elec-

trically shielding the package in order to maintain normal operating condition.

XTIN

XTOUT

(2) Low-frequency Oscillation

XIN

XOUT

(1) High-frequency Oscillation

TMP86FS64FG Datasheet(PDF) 247 Page - Toshiba Semiconductor