L9945 datasheet(135/144 Pages) STMICROELECTRONICS

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Table 53. TQFP64 (10x10x1 mm exp. pad down) package mechanical data

Ref

Min.

Typ.

Max.

Note

(see # in Notes below)

0°

3.5°

7°

Ө1

0°

Ө2

11°

12°

13°

Ө3

11°

12°

13°

1.2

0.05

0.15

0.95

1.05

0.17

0.22

0.27

9, 11

0.17

0.2

0.23

0.09

0.2

0.09

0.16

12.00 BSC

10.00 BSC

5, 2

6.4

4.8

0.50 BSC

12.00 BSC

E1(*)

10.00 BSC

5, 2

6.4

4.8

0.45

0.6

0.75

1.00 REF

0.08

0.2

Tolerance of form and position

aaa

0.2

1, 7

bbb

0.2

ccc

0.08

ddd

0.08

Notes

1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

2. The Top package body size may be smaller than the bottom package size up to 0.15 mm.

3. Datum A-B and D to be determined at datum plane H.

4. To be determined at seating datum plane C.

5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25

mm” per side. D1 and E1 are Maximum plastic body size dimensions including mold mismatch.

6. Details of pin 1 identifier are optional but must be located within the zone indicated.

7. All Dimensions are in millimeters.

L9945

Package information

DS12275 - Rev 10

page 135/144

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