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LSF0108 Datasheet(PDF) 213 Page - Nexperia B.V. All rights reserved |
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LSF0108 Datasheet(HTML) 213 Page - Nexperia B.V. All rights reserved |
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213 / 234 page  213 TSSOP14 (SOT402-1) TSSOP14 (SOT402-1) SOT402-1 Footprint information for reflow soldering of TSSOP14 package sot402-1_fr Issue date 17-11-28 17-12-01 occupied area solder paste deposit solder land solder land plus solder paste recommended stencil thickness: 0.125 mm 1.35 5.30 7.45 0.125 4.50 1.25 7.20 0.60 0.3 0.5 0.75 0.40 0.65 0.125 4.95 5.80 SOT402-1 Footprint information for reflow soldering of TSSOP14 package sot402-1_fr Issue date 17-11-28 17-12-01 occupied area solder paste deposit solder land solder land plus solder paste recommended stencil thickness: 0.125 mm 1.35 5.30 7.45 0.125 4.50 1.25 7.20 0.60 0.3 0.5 0.75 0.40 0.65 0.125 4.95 5.80 Minimized outline drawings and reflow soldering footprint Dimensions in mm 14-pin SMD packages 16-pin SMD packages SO14 (SOT108-1) SO14 (SOT108-1) SOT108-1 Footprint information for reflow soldering of SO14 package sot108-1_fr Issue date 09-12-13 18-10-08 0.125 1.32 1.65 1.75 1.85 1.27 0.125 8.77 10.65 5.2 7.4 7.65 recommended stencil thickness: 0.15 mm occupied area solder paste solder resist solder land 0.7 0.8 0.9 0.6 0.7 0.8 3.9 SOT108-1 Footprint information for reflow soldering of SO14 package sot108-1_fr Issue date 09-12-13 18-10-08 0.125 1.32 1.65 1.75 1.85 1.27 0.125 8.77 10.65 5.2 7.4 7.65 recommended stencil thickness: 0.15 mm occupied area solder paste solder resist solder land 0.7 0.8 0.9 0.6 0.7 0.8 3.9 03-02-19 Dimensions in mm 1.75 max 0.25 0.19 1.0 0.4 1.27 4.0 3.8 0.49 0.36 6.2 5.8 pin 1 index 8.75 8.55 17 14 8 XQFN16 (SOT1161-1) XQFN16 (SOT1161-1) Images are for reference only, for detailed drawings please visit nexperia.com/packages DFN3314-16 (SOT974-2) DFN3314-16 (SOT974-2) Unit(1) mm max nom min 0.55 0.05 0.00 0.25 0.20 0.15 3.4 3.3 3.2 2.9 2.8 2.7 1.45 1.35 1.25 0.4 2.8 0.30 0.25 0.20 0.05 A Dimensions A1 c 0.127 bD Dh EEh 0.45 0.40 0.35 ee1 k 0.2 Lv 0.1 w 0.05 y 0.05 y1 01 2 mm scale X C y C y1 tiebars are indicated on arbitrary location and size detail X A A1 c terminal 1 index area B A D E b terminal 1 index area e1 e A C B v C w L k Eh Dh 1 16 8 9 Nexperia SOT974-2 plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body 3. Soldering SOT974-2 DIMENSIONS in mm Footprint information for reflow soldering of HXSON16 package Generic footprint pattern Refer to the package outline drawing for actual layout By D Slx Sly Gx Gy Hx Hy P Ay SPx SPy nSPx nSPy SPx tot SPy tot solder land plus solder paste occupied area solder land solder paste deposit solder resist D P Gx Gy Hx Hy SPx SPy SPy tot SLy By Ay nSPx SPx tot SLx 0.05 0.05 sot974-2_fr Issue date 12-08-15 12-08-28 0.780 0.220 3.000 0.400 0.400 1.780 3.230 1.700 3.510 1.990 0.350 0.300 3 1 2.350 0.300 Fig. 2. Reflow soldering footprint for DFN3314-16 (SOT974-2) SOT974-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 Nexperia SOT974-2 plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body 3. Soldering SOT974-2 DIMENSIONS in mm Footprint information for reflow soldering of HXSON16 package Generic footprint pattern Refer to the package outline drawing for actual layout By D Slx Sly Gx Gy Hx Hy P Ay SPx SPy nSPx nSPy SPx tot SPy tot solder land plus solder paste occupied area solder land solder paste deposit solder resist D P Gx Gy Hx Hy SPx SPy SPy tot SLy By Ay nSPx SPx tot SLx 0.05 0.05 sot974-2_fr Issue date 12-08-15 12-08-28 0.780 0.220 3.000 0.400 0.400 1.780 3.230 1.700 3.510 1.990 0.350 0.300 3 1 2.350 0.300 Fig. 2. Reflow soldering footprint for DFN3314-16 (SOT974-2) SOT974-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 Nexperia SOT974-2 plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body 3. Soldering SOT974-2 DIMENSIONS in mm Footprint information for reflow soldering of HXSON16 package Generic footprint pattern Refer to the package outline drawing for actual layout By D Slx Sly Gx Gy Hx Hy P Ay SPx SPy nSPx nSPy SPx tot SPy tot solder land plus solder paste occupied area solder land solder paste deposit solder resist D P Gx Gy Hx Hy SPx SPy SPy tot SLy By Ay nSPx SPx tot SLx 0.05 0.05 sot974-2_fr Issue date 12-08-15 12-08-28 0.780 0.220 3.000 0.400 0.400 1.780 3.230 1.700 3.510 1.990 0.350 0.300 3 1 2.350 0.300 Fig. 2. Reflow soldering footprint for DFN3314-16 (SOT974-2) SOT974-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 |
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