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ST7LITE25 Datasheet(PDF) 121 Page - STMicroelectronics |
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ST7LITE25 Datasheet(HTML) 121 Page - STMicroelectronics |
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121 / 131 page ![]() ST7LITE2 121/131 PACKAGE CHARACTERISTICS (Cont’d) Table 21. THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) TBD °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C |
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