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ST72321BXXX-AUTO Datasheet(PDF) 22 Page - STMicroelectronics |
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ST72321BXXX-AUTO Datasheet(HTML) 22 Page - STMicroelectronics |
22 / 247 page ![]() Introduction ST72321Bxxx-Auto 22/247 – added Note 3 13. Table 116: OSCRANGE selection for typical resonators on page 201: – added title – removed footnote detailing SMD- and LEAD-devices 14. Table 121: EMS test results on page 205: – removed LQFP32 from conditions – added Note 1 15. Table 122: EMI emissions on page 205: – removed footnote 2 – added 32/48/60 Kbyte Flash/LQFP64 configuration – added 48/60 Kbyte ROM/LQFP44 configuration – added 32/48 Kbyte ROM/LQFP64 configuration – changed values for 60 Kbyte ROM devices 16. Section 19.7.3: Absolute maximum ratings (electrical sensitivity) on page 206: Removed text concerning dynamic latch-up (DLU) 17. Electrostatic discharge (ESD) on page 206: Replaced “JESD22-A114A/A115A standard” with “AEC-Q100-002/-003/-011 standard” in last sentence 18. Table 123: ESD absolute maximum ratings on page 206: – added AEC-Q100 standards to conditions – added ‘Class’ column – added CDM 19. Static latch-up (LU) on page 206: – updated LU content – deleted DLU content 20. Table 124: Electrical sensitivities on page 206: – updated LU conditions and class – removed DLU row 21. Table 125: I/O port pin general characteristics on page 207: – replaced symbol for input leakage current IL with Ilkg – modified Note 4 – Added Note 5 22. Table 136: 64-pin (14x14) low profile quad flat package mechanical data on page 224: Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in inches from 3 to 4 decimal digits 23. Table 137: 64-pin (10x10) low profile quad flat package mechanical data on page 225: Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in inches from 3 to 4 decimal digits 24. Table 138: 44-pin (10x10) low profile quad flat package mechanical data on page 226: Changed dimensions in mm from 2 to 3 decimal digits and changed dimensions in inches from 3 to 4 decimal digits 25. Added Section 20.3.1: Compatibility on page 227 26. Chapter 21: Device configuration and ordering information on page 228: Reorganized subsections and made minor text editing changes 27. Table 139: Thermal characteristics on page 227: |
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