7540 datasheet(258/366 Pages) RENESAS

258 / 366 page

3-36

REJ09B0018-0200Z

Rev.2.00

Jun 21, 2004

APPENDIX

7540 Group

3.2 Typical characteristics

100

150

200

-50

-25

100

125

150

100

200

300

400

-50

-25

100

125

150

0.0

0.5

1.0

1.5

2.0

Fig. 3.2.13 f(XIN)-ICC characteristics (at WIT instruction execution: Mask ROM version)

Measuring condition: At WIT instruction execution, Ta = 25 °C, Ceramic oscillation

Oscillation frequency f(XIN) [MHz]

Fig. 3.2.14 Ta-ICC characteristics (When system is operating by on-chip oscillator, Ceramic oscillation

stop: Mask ROM version)

Measuring condition: When system is operating by on-chip oscillator (A/D conversion not executed),

Ceramic oscillation stop

Operating temperature range [°C]

Fig. 3.2.15 Ta-ICC characteristics (When system is operating by on-chip oscillator, at WIT instruction

execution, Ceramic oscillation stop: Mask ROM version)

Measuring condition: When system is operating by on-chip oscillator, at WIT instruction execution,

Ceramic oscillation stop

Operating temperature range Ta [°C]

(3) Power source current characteristic example (Ta-ICC characteristics)

VCC = 5.0 V

VCC = 3.0 V

VCC = 5.0 V

VCC = 3.0 V

VCC = 5.0 V

VCC = 3.0 V

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