LED

LAMP APPLICATION

SOLDERING

METHOD

SOLDERING CONDITIONS

REMARK

DIP

SOLDERING

Bath temperature: 260±5

Immersion time: with 5 sec

Solder no closer than 3mm from the

base of the package

Using soldering flux,” RESIN FLUX”

is recommended.

SOLDERING

IRON

Soldering iron: 30W or smaller

Temperature at tip of iron: 260

or lower

Soldering time: within 5 sec.

During soldering, take care not to

press the tip of iron against the

lead.

(To prevent heat from being

transferred directly to the lead, hold

the lead with a pair of tweezers

while soldering

1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),

be careful not to stress the leads with iron tip.

2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.

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