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TMS320DM647 Datasheet(PDF) 177 Page - Texas Instruments |
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TMS320DM647 Datasheet(HTML) 177 Page - Texas Instruments |
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177 / 181 page  TMS320DM647 TMS320DM648 www.ti.com SPRS372F – JANUARY 2010 – REVISED SEPTEMBER 2009 7.2 Packaging Information The following packaging information reflects the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document. Package Package Package Eco Lead/Ball Orderable Device Status(1) Pins MSL Peak Temp(3) Type Drawing Qty Plan(2) Finish Pb-Free TMS320DM647ZUT1 ACTIVE FCBGA ZUT 529 84 Call TI Level-4-245C-72HR (RoHS) Pb-Free TMS320DM647ZUT7 ACTIVE FCBGA ZUT 529 84 SNAGCU Level-4-245C-72HR (RoHS) Pb-Free TMS320DM647ZUT9 ACTIVE FCBGA ZUT 529 84 SNAGCU Level-4-245C-72HR (RoHS) Pb-Free TMS320DM647ZUTA8 ACTIVE FCBGA ZUT 529 84 Call TI Level-4-245C-72HR (RoHS) TMS320DM647ZUTD7 ACTIVE FCBGA ZUT 529 TBD Call TI Call TI TMS320DM647ZUTD9 ACTIVE FCBGA ZUT 529 TBD Call TI Call TI Pb-Free TMS320DM648ZUT1 ACTIVE FCBGA ZUT 529 84 Call TI Level-4-245C-72HR (RoHS) Pb-Free TMS320DM648ZUT7 ACTIVE FCBGA ZUT 529 84 SNAGCU Level-4-245C-72HR (RoHS) Pb-Free TMS320DM648ZUT9 ACTIVE FCBGA ZUT 529 84 SNAGCU Level-4-245C-72HR (RoHS) Pb-Free TMS320DM648ZUTA8 ACTIVE FCBGA ZUT 529 1 Call TI Level-4-245C-72HR (RoHS) Pb-Free TMS320DM648ZUTD7 ACTIVE FCBGA ZUT 529 84 Call TI Level-4-245C-72HR (RoHS) Pb-Free TMS320DM648ZUTD9 ACTIVE FCBGA ZUT 529 84 Call TI Level-4-245C-72HR (RoHS) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Copyright © 2010–2009, Texas Instruments Incorporated Mechanical Data 177 Submit Documentation Feedback Product Folder Link(s): TMS320DM647 TMS320DM648 |
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