LDS8711

© 2010 IXYS Corp.

9

Doc. No. 8711DS, Rev. N1.0

Characteristics subject to change without notice

achieve better efficiency and driver’s stability.

Recommended Layout

In active mode, the driver switches internally at a high

frequency. We recommend minimize trace length to

all external capacitors and inductor. The input and

output ceramic capacitors (X5R or X7R type) should

located as close to the device’ pins as possible to

prevent from EMI distribution

A ground plane should cover the area under the

driver IC as well as the bypass capacitors. Short

be implemented with the use of multiple via. A copper

area matching the TDFN exposed pad (PAD) must

be connected to the ground plane underneath. The

use of multiple via improves the package heat

dissipation.

Figure 4. Recommended layout