SW38-2G datasheet(107/116 Pages) AAVID

107 / 116 page

107

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Mounting Pads

• Prevent heat damage during soldering

• Facilitate board clean-up

• Prevent solder bridges

• Assure uniform device height

MAXIMUM OPERATING TEMPERATURE

* All “DAP” mounting pads meet UL 94 V-0

Index of Semiconductor Lead Conversion Pads

Index of Semiconductor Mounting Pads

Suffix

Base material

Continuous

Deflection

Color

Nylon base resin

121.0°C 250°F

243.3°C 470°F

Natural

per ASTM STD

D4066-82-PA111

DAPG*

Diallyl Phthalate

204.4°C 400°F

282.2°C 540°F

Black only

per MIL-M-14G

type SDG

Converts lead

Part number

spacing from

# of Leads

Outside dia

Thickness

7717-130G

0.05 In-Line

TO-92 & TO-15

5.84 (0.230)

1.02 (0.040)

7717-247G

TO-18

TO-5

7.11 (0.280)

3.81 (0.170)

7717-26G

TO-18

TO-5

8.71 (0.343)

3.05 (0.120)

7717-44G

TO-18

TO-5

7.75 (0.305)

3.18 (0.125)

For TO-18

For epoxy transistors

For TO-5

For TO-18

For integrated circuits

Misc. mounting pads

FEATURES

PRODUCT INFORMATION

ORDERING INFORMATION

See pages 108 and 109 for mechanical drawings

Note: Please specify material for each mounting pad: “N” = nylon; “DAP” = Diallyl Phtalate.

Example: 7717-3NG, 7717-86DAPG

Part number

Leads

Outside dia

Thickness

7717-86G

8.71 (0.343)

1.91 (0.075)

7717-178G

8.89 (0.350)

0 .53 (0.021)

7717-79G

9.02 (0.355)

0.97 (0.038)

7717-3G

3–4

8.64 (0.340)

1.91 (0.075)

7717-15G

8.89 (0.350)

0.51 (0.020)

7717-5G

8.89 (0.350)

3.18 (0.125)

7717-4G

9.53 (0.375)

1.91 (0.075)

7717-16G

5.08 (0.200)

0.51 (0.020)

7717-18G

5.08 (0.200)

2.54 (0.100)

7717-108G

5.16 (0.203)

1.78 (0.070)

7717-89G

6.35 (0.250)

2.03 (0.080)

7717-7G

6.35 (0.250)

3.18 (0.125)

7717-122G

9.27 (0.365)

1.78 (0.070)

7717-8G

9.53 (0.375)

1.91 (0.075)

7717-156G

19.05 x 11.43 (0.750 x 0.450)

1.27 (0.050)

7717-175G Crystal Can Relay

10.16 / 20.32 (0.400 x 0.800)

1.27 (0.050)

SW38-2G Datasheet(PDF) 107 Page - Aavid, Thermal Division of Boyd Corporation

SW38-2G Datasheet(HTML) 107 Page - Aavid, Thermal Division of Boyd Corporation

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