TPS92510

SLUSAE4A – JANUARY 2012 – REVISED JUNE 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE DEVICE

PACKAGE

PINS

OUTPUT SUPPLY

MINIMUM QUANTITY

NUMBER

Tube

80

TPS92510DGQ

PowerPAD Plastic

–40°C to 150°C

10

Small Outline (MSOP)

Tape and Reel

2500

TPS92510DGQR

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating temperature range (unless otherwise noted).

VALUE

UNIT

MIN

MAX

VIN

–0.3

65

PDIM, EN

–0.3

6

Input voltage

BOOT

73

V

VSENSE, TSENSE, COMP

–0.3

3

RT/CLK

–0.3

3.6

BOOT-PH

8

Output voltage

PH

–0.6

65

V

PH, 10-ns Transient

–2

65

Voltage Difference

PAD to GND

±200

mV

EN

100

μA

BOOT

100

mA

VSENSE

10

μA

Source current

Current

PH

A

Limit

RT/CLK

100

μA

Current

VIN

A

Limit

Sink current

COMP, VSENSE, EN

100

μA

Electrostatic Discharge (HBM) QSS 009-105 (JESD22-A114A)

2

kV

Electrostatic Discharge (CDM) QSS 009-147 (JESD22-C101B.01)

500

V

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2

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