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M24LR04E-R Datasheet(PDF) 136 Page - STMicroelectronics |
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M24LR04E-R Datasheet(HTML) 136 Page - STMicroelectronics |
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136 / 142 page ![]() Part numbering M24LR04E-R 136/142 Doc ID 022208 Rev 5 31 Part numbering Table 129. Ordering information scheme for bare die devices or packaged devices Example: M24LR04E-R MN 6 T /2 Device type M24LR = dual interface EEPROM 04 = memory size in Kbit E = support for energy harvesting Operating voltage R = VCC = 1.8 to 5.5 V Package MN = SO8N (150 mils width) MC = UFDFPN8 (MLP8) DW = TSSOP8 UW20 = inkless, unsawn wafer, with no backgrinding(1) 1. Delivery type: wafer tested, unsawn, without backgrinding. Wafer thickness: 725 µm ±20 µm. Bad chip identification by STIF wafer maps provided by STMicroelectronics. Device grade(2) 2. For packaged devices only. 6 = industrial: device tested with standard test flow over –40 to 85 °C Option(2) T = Tape and reel packing Capacitance /2 = 27.5 pF |
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