INTEDG datasheet(389/478 Pages) MICROCHIP

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 2010-2012 Microchip Technology Inc.

DS41414D-page 389

PIC16(L)F1946/47

30.0 ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings(†)

Ambient temperature under bias....................................................................................................... -40°C to +125°C

Storage temperature ........................................................................................................................ -65°C to +150°C

Voltage on VDD with respect to VSS, PIC16F1946/47 ........................................................................ -0.3V to +6.5V

Voltage on VCAP pin with respect to VSS.............................................................................................. -0.3V to +4.0V

Voltage on VDD with respect to VSS, PIC16LF1946/47 ...................................................................... -0.3V to +4.0V

Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V

Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)

Total power dissipation(1) ............................................................................................................................... 800 mW

Maximum current out of VSS pin, -40°C

 TA  +85°C for industrial............................................................... 425 mA

Maximum current out of VSS pin, -40°C

 TA  +125°C for extended ............................................................ 175 mA

Maximum current into VDD pin, -40°C

 TA  +85°C for industrial.................................................................. 425 mA

Maximum current into VDD pin, -40°C

 TA  +125°C for extended ............................................................... 175 mA

Clamp current, IK (VPIN < 0 or VPIN > VDD)

20 mA

Maximum output current sunk by any I/O pin.................................................................................................... 25 mA

Maximum output current sourced by any I/O pin .............................................................................................. 25 mA

Note 1:

Power dissipation is calculated as follows: PDIS = VDD x {IDD –

 IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL).

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for

extended periods may affect device reliability.

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