Subject to change without notice.

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FEATURES

Small Chip – 200 x 200 x 50 μm

UT LED Performance

2.5mW min. (520-535 nm) Green

5.5 mW min. (455–475 nm) Blue

8.0 mW min. (455-475 nm) Blue

Low Forward Voltage

2.9 V Typical at 5 mA

Single Wire Bond Structure

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APPLICATIONS

Mobile Phone Keypads

Audio Product Display Lighting

Mobile Appliance Keypads

Automotive Applications

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Data Sheet

CxxxUT2200-Sxxxxx

superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low

forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications. Applications

include keypad backlighting where sub-miniaturization and thinner form factors are required.

CxxxUT2200-Sxxxxx Chip Diagram

Top View

Bottom View

G•SiC LED Chip

200 x 200 μm

SiC Substrate

h = 50 μm

Backside

Metallization

80 x 80 μm

Gold Bond Pad

90 μm Diameter

Die Cross Section

Cathode (-)

Anode (+)

SiC Substrate

Bottom Surface

Mesa (junction)

150 x 150 μm

InGaN