TLV61220

SLVSB53A – MAY 2012 – REVISED DECEMBER 2014

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage on VBAT, SW, VOUT, EN, FB

–0.3

7.5

V

Operating junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage at VIN

0.7

5.5

V

Operating free air temperature range

–40

85

°C

Operating virtual junction temperature range

–40

125

°C

8.4 Thermal Information

TLV61220

DBV

UNIT

6 PINS

Junction-to-ambient thermal resistance

185.7

Junction-to-case (top) thermal resistance

124.3

Junction-to-board thermal resistance

31.3

°C/W

Junction-to-top characterization parameter

22.9

Junction-to-board characterization parameter

30.8

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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