-40 -20

0

20 40 60 80 100 120 140 160

0

0.2

0.4

0.6

0.8

1

1.2

1.4

TEMPERATURE (°C)

Operating area

Ma

xi

mu

m

the

rma

l ca

pa

bili

ty

lin

e

(SO

IC

)

Ma

ximu

m

the

rma

l ca

pab

ility

line

(MSO

P)

LM7332

www.ti.com

SNOSAV4B – APRIL 2008 – REVISED JANUARY 2016

Figure 54 shows the power capability vs temperature for VSSOP and SOIC packages. The area under the

maximum thermal capability line is the operating area for the device. When the device works in the operating

intersection of ambient temperature and package power is above the maximum thermal capability line, the

junction temperature will exceed 150°C, and this must be strictly prohibited.

Figure 54. Power Capability vs Temperature

When high power is required and ambient temperature cannot be reduced, providing air flow is an effective

approach to reduce thermal resistance therefore to improve power capability.

Copyright © 2008–2016, Texas Instruments Incorporated

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