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LM7332 Datasheet(PDF) 4 Page - Texas Instruments |
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LM7332 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 34 page ![]() LM7332 SNOSAV4B – APRIL 2008 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings See (1) (2) MIN MAX UNIT VIN differential ±10 V Output short-circuit duration See (3)(4) Supply voltage (VS = V + – V−) 35 V Voltage at input/output pins V+ + 0.3 V− − 0.3 V Junction temperature(5) 150 °C Infrared or convection (20 sec.) 235 °C Soldering information Wave soldering (10 sec.) 260 °C Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications. (3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (4) Short-circuit test is a momentary test. Output short circuit duration is infinite for VS ≤ 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5 ms. (5) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PC board. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V(ESD) Electrostatic discharge V Machine model (MM) ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). 6.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage (VS = V + – V−) 2.5 32 V Temperature range(1) −40 125 °C (1) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB. 6.4 Thermal Information LM7332 THERMAL METRIC(1) DGK (VSSOP) D (SOIC) UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance (2) 161.1 109.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 55 55.8 °C/W RθJB Junction-to-board thermal resistance 80.5 49.2 °C/W ψJT Junction-to-top characterization parameter 5.5 10.7 °C/W ψJB Junction-to-board characterization parameter 79.2 48.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB. 4 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated Product Folder Links: LM7332 |
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