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PI3546-00-LGIZ Datasheet(PDF) 34 Page - Vicor Corporation |
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PI3546-00-LGIZ Datasheet(HTML) 34 Page - Vicor Corporation |
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34 / 37 page  The recommended component placement, shown in Figure 71, illustrates the tight path between CIN and COUT (and VIN and VOUT) for the high AC return current. This optimized layout is used on the PI354x-00 evaluation board. Figure 72 details the recommended receiving footprint for PI354x-00 10 mm x 10 mm package. All pads should have a final copper size of 0.55 mm x 0.55 mm, whether they are solder-mask defined or copper defined, on a 1 mm x 1 mm grid. All stencil openings are 0.45 mm when using either a 5 mil or 6 mil stencil. Cool-Power® Rev 1.3 vicorpower.com Page 34 of 37 2/2016 800 927.9474 PI354x-00 Detail A - Recommended soldermask openings. CDP = Copper defined pads. A 0.50mm 1.00mm 0.50mm Pin A1 Outline of 10mm x 10 mm SIP package. All pads are on 1mm square grid. 0.55mm 0.55mm (CDP) 0.65mm 0.55mm 0.65mm 0.55mm (CDP) 1.00mm Figure 72 — Recommended Receiving PCB footprint IN C OUT C OUT IN V V GND VSW GND Figure 71 — Recommended component placement and metal routing Recommended PCB Footprint and Stencil |
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