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OPA622 Datasheet(PDF) 4 Page - Texas Instruments |
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OPA622 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 19 page ![]() OPA622 4 ® PAD FUNCTION 1 Quiescent Current Adjustment 2 Inverting Analog Input 3 Non-Inverting Analog Input 4NC 5NC 6 –5V Supply 7 –5V Supply, Output 8 Inverting Buffer Output 9 Analog Output 10 Analog OTA Output 11 +5V Supply, Output 12 +5V Supply 13 Non-Inverting Buffer Output Substrate Bias: Negative Supply NC: No Connection Wire Bonding: Gold wire bonding is recommended. DICE INFORMATION MECHANICAL INFORMATION MILS (0.001") MILLIMETERS Die Size 57 x 69 ±5 1.44 x 1.76 ±0.13 Die Thickness 14 ±1 0.55 ±0.025 Min. Pad Size 4 x 4 0.10 x 0.10 Backing: Titanium 0.02+0.05,–0.0 0.0005+0.0013, –0.0 Gold 0.30 ±0.05 0.0076 ±0.0013 OPA622AD DIE TOPOGRAPHY PIN NO. DESCRIPTION FUNCTION 1 NC No Connection 2IQ Adjust Quiescent Current Adjustment; typical 3-8mA 3 –In Inverting Analog Input 4 +In Noninverting Analog Input 5–VCC Negative Supply Voltage; typical –5VDC 6–VCC OUT Negative Supply Voltage Output Buffer; typical –5VDC 8 BUF– Analog Output Feedback Buffer 9VOUT Analog Output 10 OTA Analog Output OTA 11 +VCC OUT Positive Supply Voltage Output Buffer; typical +5VDC 12 +VCC Positive Supply Voltage; typical +5VDC 13 BUF+ Analog Output/Input 14 NC No Connection PIN CONFIGURATION FUNCTIONAL DESCRIPTION NC I Q Adjust –In +In –V CC –V CC OUT NC NC BUF+ +V CC +V CC OUT OTA V OUT BUF– 1 2 3 4 5 6 7 OPA622 14 13 12 11 10 9 8 FB OTA OB 13 4 10 3 512 2 Biasing 11 6 8 SO/DIP 9 Top View ELECTROSTATIC DISCHARGE SENSITIVITY Electrostatic discharge can cause damage ranging from per- formance degradation to complete device failure. Burr- Brown Corporation recommends that all integrated circuits be handled and stored using appropriate ESD protection methods. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published specifications. |
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