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OPA622 Datasheet(PDF) 15 Page - Texas Instruments |
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OPA622 Datasheet(HTML) 15 Page - Texas Instruments |
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15 / 19 page  OPA622 15 ® when a signal is applied. For high-speed op amps, a more precise approach to determine power consumption is to measure the average total quiescent current for several typical load conditions. The power consumption of the OPA622 is influenced by the signal type and frequency, the output voltage and load resistor, and the repetition rate of the signal transitions. Figure 14 shows the total average supply current versus the frequency of an applied sine wave for various output voltages. Figure 15 illustrates the total quiescent current versus the repetition frequency of an applied square wave signal. CIRCUIT LAYOUT The high-frequency performance of the OPA622 can be greatly affected by the physical layout of the printed circuit board. The following tips are offered as suggestions, not as absolute musts. Oscillations, ringing, poor bandwidth and settling, and peaking are all typical problems that plague high-speed components when they are used incorrectly. • Bypass power supplies very close to the device pins. Use tantalum chip capacitors (approximately 2.2 µF) and a parallel 470pF ceramic chip capacitor. Surface-mount types are recommended because of their low lead inductance. • PC board traces for power lines should be wide to reduce impedance. • Make short, low-inductance traces. The entire physical circuit should be as small as possible. • Use a low-impedance ground plane on the component side to ensure that low-impedance ground is available through- out the layout. • Place the ROG resistor as close as possible to the package and use the shortest possible trace length. • Do not extend the ground plane over high-impedance nodes sensitive to stray capacitances such as the amplifier’s input and ROG terminals. • Sockets are not recommended, because they add signifi- cant inductance and parasitic capacitance. If sockets are required, use zero-profile solderless sockets. • Use low-inductance, surface-mount components for best AC performance. • A resistor (50 Ω to 330Ω) in series with the high-imped- ance inputs is strictly recommended for stable operation. • Plug-in prototype boards and wire-wrap boards will not function well. A clean layout using RF techniques is essential. FIGURE 11. Optimum Response vs Closed-Loop Gains. FIGURE 12. Closed-Loop Gain vs R OG. 10 5 0 –5 –10 –15 –20 –25 Frequency (Hz) 100k 1M 10M 100M 1G R OG = 50Ω R OG = 150Ω R OG = 300Ω G CL = +2V/V 15 10 5 0 –5 –10 –15 –20 –25 1M 10M 1M 1G Frequency (Hz) 20 –30 R OG = 10Ω 100k R OG = 150Ω R OG = 390Ω R OG = 200Ω R OG = 120Ω G CL = +10 G CL = +2 G CL = +1 G CL = –1 G CL = –2 OPA622AP V O = 1.4Vp-p, Refer to Table I for recommended component values. FIGURE 14. Average Supply Current vs Frequency (Sine Wave). FIGURE 13. Bandwidth vs C LOAD. 1M 10M 100M 1G Frequency (Hz) G CL = +2V/V, VO = 2.8Vp-p 10pF 22pF 47pF C LOAD R OG C OTA 10p180 Ω 0.5p 22p200 Ω0.5p 47p150 Ω0.5p 50 40 30 20 10 0 Frequency (Hz) 300k 1M 10M 100M 1G G = +2V/V, R LOAD = 100Ω 5Vp-p 2.8Vp-p 1.4Vp-p 0.2Vp-p |
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