 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
BD1754HFN Datasheet(PDF) 12 Page - Rohm |
|
|
|||||||||||||||||||||||||||||
BD1754HFN Datasheet(HTML) 12 Page - Rohm |
|
|
12 / 21 page  12/17 BD1754HFN Datasheet TSZ02201-0G3G0C200060-1-2 10.Dec.2015 Rev.002 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 (7) Circuit example when connecting the two LEDs to each of the channels in series IN ISET GND Current DAC UPIC 6 EN L4 L3 L2 L1 Power Supply2=6.2V to 7V 0.1µF 120k Ω The voltage value of L* pin must be VIN-1.4 V at the maximum when the LED is powered ON. Power Supply1 (When ILED-max=32mA) (Maximum rating = 7.0 V) On the assumption that VF is 3 V (Ex.) Figure 19. Circuit example when connecting the two LEDs to each of the channels in series This figure shows a circuit example when making 8 (2 x 4) LEDs available by connecting two LEDs to each of the channels in series. In this example, when VF is set to approx. 3 V in order to ensure the voltage to L1 through L4 pins, it is necessary to apply a voltage of 6.2 V (3 V x 2 LEDs in series + 0.2 V of the minimum voltage value of the driver pin) or higher to the LED anode pin as its power supply voltage. Pay attention that the voltage should not exceed the 7.0-V maximum rating of the L1 through L4 pins. Determine the resistance value with which the LED current value is maximized and then connect such resistor between the ISET and the GND pins. The power ON/OFF and the brightness of the LEDs are controlled through the EN pin in accordance with the UPIC format. 3. Selection of Components Externally Connected <Capacitor> Symbol Recommended Value Recommended Component Manufacturer CIN 0.1µF GRM188B31H104KA92B MURATA <Resistor> Symbol Recommended Value Recommended Component Manufacturer RISET 120kΩ MCR10PZHZF1203 ROHM 4. Recommended PCB Layout Design PCB pattern to provide low impedance for the wiring to the power supply line. Also, provide a bypass capacitor if needed. Figure 20. Layout Image of the Application Components (Top View) Figure 21. Surface (Top View) <Heat radiation PAD of back side> PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin. Moreover, connect ground plane (GND) of board using via as shown in the patterns of next page. The efficiency of heat radiation improves according to the area of ground plane (GND). L4 L2 L1 L3 EN ISET IN GND EN GND CIN RISET LED_PWR IN LED_PWR EN GND IN RISET Connect CIN input-bypass capacitor in close proximity between the IN and GND pins. Connect the RISET resistor in close proximity to the ISET pin. |
Similar Part No. - BD1754HFN_15 |
|
Similar Description - BD1754HFN_15 |
|
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
