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STM32L476VC Datasheet(PDF) 213 Page - STMicroelectronics |
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STM32L476VC Datasheet(HTML) 213 Page - STMicroelectronics |
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213 / 232 page  DocID025976 Rev 4 213/232 STM32L476xx Package information 228 Figure 53. UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array package recommended footprint e - 0.500 - - 0.0197 - Z - 0.750 - - 0.0295 - ddd - 0.080 - - 0.0031 - eee - 0.150 - - 0.0059 - fff - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 106. UFBGA132 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Ball diameter 0.280 mm Table 105. UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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