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8S003F3P6 Datasheet(PDF) 85 Page - STMicroelectronics |
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8S003F3P6 Datasheet(HTML) 85 Page - STMicroelectronics |
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85 / 104 page  DocID018576 Rev 9 85/104 STM8S003F3 STM8S003K3 Electrical characteristics 87 9.3.11 EMC characteristics Susceptibility tests are performed on a sample basis during product characterization. Functional EMS (electromagnetic susceptibility) While executing a simple application (toggling 2 LEDs through I/O ports), the product is stressed by two electromagnetic events until a failure occurs (indicated by the LEDs). • ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device until a functional disturbance occurs. This test conforms with the IEC 61000-4-2 standard. • FTB: A burst of fast transient voltage (positive and negative) is applied to VDD and VSS through a 100 pF capacitor, until a functional disturbance occurs. This test conforms with the IEC 61000-4-4 standard. A device reset allows normal operations to be resumed. The test results are given in the table below based on the EMS levels and classes defined in application note AN1709. Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. Software recommendations The software flowchart must include the management of runaway conditions such as: • Corrupted program counter • Unexpected reset • Critical data corruption (control registers...) Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be recovered by applying a low state on the NRST pin or the oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Table 48. EMS data Symbol Parameter Conditions Level/class VFESD Voltage limits to be applied on any I/O pin to induce a functional disturbance VDD = 3.3 V, TA = 25 °C, fMASTER = 16 MHz, conforming to IEC 61000-4-2 2B(1) 1. Data obtained with HSI clock configuration, after applying HW recommendations described in AN2860 - EMC guidelines for STM8Smicrocontrollers. VEFTB Fast transient voltage burst limits to be applied through 100pF on VDD and VSS pins to induce a functional disturbance VDD = 3.3 V, TA = 25 °C, fMASTER = 16 MHz, conforming to IEC 61000-4-4 4A(1) |
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