S3C72G9 datasheet(39/96 Pages) SAMSUNG

Part #	S3C72G9

Description	SAM47 INSTRUCTION SET

Download	96 Pages

Scroll/Zoom	100%

Manufacturer	SAMSUNG [Samsung semiconductor]

Direct Link	http://www.samsung.com/Products/Semiconductor

Logo

39 / 96 page

',#$%),'

BTSF

(Continued)

Examples:

3. P0.2, P0.3 and P1.0-P1.3 are tested:

LD

L,#2H

BP2

BTSF

P0.@L

; First, P1.@02H = P0.2

; (111100B) + 00B.10B = 0F0H.2

RET

INCS

L

CPSE

L,#8H

JR

BP2

4. Bank 0, location 0A0H.0, is tested and (regardless of the current EMB value) BTSF has the

following effect:

FLAG

EQU

0A0H.0

BITR

EMB

LD

H,#0AH

BTSF

@H+FLAG ;

If bank 0 (AH + 0H).0 = 0A0H.0 = "0", then skip

RET

Similar Part No. - S3C72G9

Manufacturer	Part #	Datasheet	Description
Samsung semiconductor	S3C72G9	181Kb / 28P	The S3C72G9 single-chip CMOS microcontroller has been designed for high performance using Samsungs newest 4-bit CPU core, SAM47 (Samsung Arrangeable M

Manufacturer	Part #	Datasheet	Description
Samsung semiconductor	S3C7574	150Kb / 33P	Product Overview Address Spaces Addressing Modes Memory Map SAM47 Instruction Set
STMicroelectronics	STLUX385	171Kb / 10P	Extended instruction set February 2013 Rev 2
	STM8S007C8	1Mb / 92P	Extended instruction set March 2015 Rev 5
	STM8S005C6	1Mb / 97P	Extended instruction set March 2015 Rev 4
	STM8S003F3	1Mb / 104P	Extended instruction set May 2017 Rev 9
	STM8S105C4	1Mb / 121P	Extended instruction set September 2015 Rev 15
Samsung semiconductor	S3C9442	259Kb / 50P	SAM88RCRI INSTRUCTION SET
Freescale Semiconductor...	S9S08DZ32F1CLH	2Mb / 416P	HC08 instruction set with added BGND instruction
STMicroelectronics	ST20-C1	856Kb / 205P	Instruction Set Reference Manual
Freescale Semiconductor...	MC9S08GW64	1,011Kb / 42P	HC08 instruction set with added BGND instruction