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LM741-MIL

SNOSD62 – JUNE 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those specified in the Recommended

Operating Conditions table. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For military specifications see RETS741X for LM741-MIL and RETS741AX for LM741-MILA.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

(5)

For supply voltages less than ±15 V, the absolute maximum input voltage is equal to the supply voltage.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Supply voltage

±22

V

500

mW

Differential input voltage

±30

V

±15

V

Output short circuit duration

Continuous

Operating temperature

–50

125

°C

150

°C

–65

150

°C

(1)

Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows

safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±400

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage (VDD-GND)

±10

±15

±22

V

Temperature

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

LM741-MIL

UNIT

LMC (TO-99)

NAB (CDIP)

P (PDIP)

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

170

100

100

°C/W

Junction-to-case (top) thermal resistance

25

—

—

°C/W