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MPX2202DP Datasheet(PDF) 333 Page - Motorola, Inc |
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MPX2202DP Datasheet(HTML) 333 Page - Motorola, Inc |
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333 / 670 page  MPXV6115VC6U 3–187 Motorola Sensor Device Data www.motorola.com/semiconductors SURFACE MOUNTING INFORMATION MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct pad geometry, the packages will self–align when subjected to a solder reflow process. It is always recommended to fabri- cate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 2.54 0.300 7.62 Figure 5. SOP Footprint (Case 482A) inch mm Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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