STPS1L60 datasheet(4/6 Pages) STMICROELECTRONICS

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STPS1L60

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Figure 9: Reverse leakage current versus

reverse voltage applied (typical values)

Figure

10:

Junction

capacitance

versus

reverse voltage applied (typical values)

Figure 11:

Forward

voltage

drop

versus

forward current (maximum values, high level)

(SMA)

Figure

12: Forward

voltage drop versus

forward current (maximum values, low level)

(DO-41)

Figure 13: Thermal resistance junction to

ambient versus copper surface under each

lead (Epoxy printed circuit board FR4, copper

thickness: 35µm) (SMA)

Figure 14: Thermal resistance versus lead

length (DO-41)

I (mA)

1E-4

1E-3

1E-2

1E-1

1E+0

1E+1

V (V)

T =125°C

T =100°C

T =25°C

C(pF)

100

200

V (V)

F=1MHz

T =25°C

(A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

2.6

(V)

T =25°C

T =100°C

(A)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

(V)

T =100°C

T =25°C

(°C/W)

th(j-)

2345

100

120

140

S(Cu)(cm²)

100

120

10152025

R (°C/W)

(mm)

leads

Rth(j-a)

Rth(j-I)

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