4

OPA375

SBOS886 – NOVEMBER 2017

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted

MIN

MAX

UNIT

6

V

Signal input

terminals

Voltage

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

Current

–10

10

mA

Output short-circuit

Continuous

mA

–40

125

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±3000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2.25 (±1.125)

5.5 (±2.75)

V

Ambient operating temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

OPA375

UNIT

DCK (SC70)

5 PINS

Junction-to-ambient thermal resistance

240.9

°C/W

Junction-to-case (top) thermal resistance

151.7

°C/W

Junction-to-board thermal resistance

64

°C/W

Junction-to-top characterization parameter

34.8

°C/W

Junction-to-board characterization parameter

63.3

°C/W