KWCSLPM2.PC datasheet(16/25 Pages) OSRAM

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KWCSLPM2.PC Datasheet(PDF) 16 Page - OSRAM GmbH

16 / 25 page

2017-09-22

Version 1.0

KW CSLPM2.PC

Recommended Solder Pad 8) page 24

Reflow soldering

Empfohlenes Lötpaddesign 8) Seite 24

Reflow-Löten

Note:

For superior solder joint connectivity results we

recommend soldering under standard nitrogen

atmosphere.

Package not suitable for ultra sonic cleaning.

Anm.:

Um eine verbesserte Lötstellenkontaktierung zu

erreichen, empfehlen wir, unter Standard-

Stickstoffatmosphäre zu löten.

Das Gehäuse ist für Ultraschallreinigung nicht

geeignet.

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