IW1819 datasheet(4/6 Pages) DIALOG

4 / 6 page

iW1819

18W AccuSwitchTM Quasi-Resonant PWM Controller

with Integrated Power BJT for 9V+ Applications

Rev. 0.1 Preliminary

Product Summary

www.dialog-semiconductor.com

4 of 6

19-Dec-2017

Parameter

Symbol

Value

Units

DC supply voltage range (pin 2, ICC = 20mA max)

VCC

-0.3 to 25.0

Continuous DC supply current at VCC pin (VCC = 15V)

ICC

ASU output (pin 10)

-0.3 to 19.0

VSENSE input (pin 1, IVSENSE ≤ 10mA)

-0.7 to 4.0

ISENSE input (pin 9)

-0.3 to 4.0

Collector-Emitter breakdown voltage

(Emitter and base shorted together; IC = 1mA, REB = 0Ω)

VCES

800

Collector current (Note 1)

Collector peak current (Note 1) (tp < 1ms)

ICM

Maximum junction temperature

TJMAX

150

°C

Operating junction temperature

TJOPT

-40 to 150

°C

Storage temperature

TSTG

-55 to 150

°C

Electrostatic Discharge Capability (Human Body Model), JEDEC JS-001-2012

ESD(HBM)

±2000

Electrostatic Discharge Capability (Charged Device Model), JESD22-C101

ESD(CDM)

±1000

Latch-up test per JESD78D

±100

Notes:

Note 1.

Limited by maximum junction temperature.

Absolute maximum ratings are the parameter values or ranges which can cause permanent damage if exceeded.

5 Absolute Maximum Ratings

6 Thermal Characteristics

Parameter

Symbol

Value

Units

Thermal Resistance Junction-to-Ambient1

θJA

°C/W

Thermal Resistance Junction-to-Collector pin (pin 7 and pin 8)2

ψJB

°C/W

Thermal Shutdown Threshold3

TSD

150

°C

Thermal Shutdown Recovery3

TSD-R

120

°C

Notes:

Note 1.

Device is mounted on a JEDEC single-sided board with 100mm2 of 35μm thick copper, in a one-cubic-foot natural

convection chamber with 1W dissipated power.

Note 2.

ψJB [Psi Junction to Board] provides an estimation of the die junction temperature relative to the PCB [Board] surface

temperature. ψJB is measured at the ground pin (pin 3) without using any thermal adhesives. See Section 10.14 for more

information.

Note 3.

These parameters are typical and they are guaranteed by design.

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