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IW1820 Datasheet(PDF) 4 Page - Dialog Semiconductor |
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IW1820 Datasheet(HTML) 4 Page - Dialog Semiconductor |
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4 / 6 page ![]() iW1820 15W AccuSwitchTM Quasi-Resonant PWM Controller with Integrated Power BJT for 5V Applications Rev. 0.1 Preliminary Product Summary © 2017 Dialog Semiconductor www.dialog-semiconductor.com 4 of 6 19-Dec-2017 Parameter Symbol Value Units DC supply voltage range (pin 2, ICC = 20mA max) VCC -0.3 to 25.0 V Continuous DC supply current at VCC pin (VCC = 15V) ICC 25 mA ASU output (pin 10) -0.3 to 19.0 V VSENSE input (pin 1, IVSENSE ≤ 10mA) -0.7 to 4.0 V ISENSE input (pin 9) -0.3 to 4.0 V Collector-Emitter breakdown voltage (Emitter and base shorted together; IC = 1mA, REB = 0Ω) VCES 800 V Collector current (Note 1) IC 4 A Collector peak current (Note 1) (tp < 1ms) ICM 8 A Maximum junction temperature TJMAX 150 °C Operating junction temperature TJOPT -40 to 150 °C Storage temperature TSTG -55 to 150 °C Electrostatic Discharge Capability (Human Body Model), JEDEC JS-001-2012 ESD(HBM) ±2000 V Electrostatic Discharge Capability (Charged Device Model), JESD22-C101 ESD(CDM) ±1000 V Latch-up test per JESD78D ±100 mA Notes: Note 1. Limited by maximum junction temperature. Absolute maximum ratings are the parameter values or ranges which can cause permanent damage if exceeded. 5 Absolute Maximum Ratings 6 Thermal Characteristics Parameter Symbol Value Units Thermal Resistance Junction-to-Ambient (Note 1) θJA TBD °C/W Thermal Resistance Junction-to-GND pin (pin 8) (Note 2) ψJB TBD °C/W Thermal Resistance Junction-to-Collector pin (Note 2) ψJ-BJT TBD °C/W Thermal Shutdown Threshold (Note 3) TSD 150 °C Thermal Shutdown Recovery (Note 3) TSD-R 100 °C Notes: Note 1. Device is mounted on a JEDEC single-sided board with 100mm2 of 35μm thick copper, in a one-cubic-foot natural convection chamber with 1W dissipated power. Note 2. ψJB [Psi Junction to Board] provides an estimation of the die junction temperature relative to the PCB [Board] surface temperature. ψJB is measured at the ground pin (pin 3) without using any thermal adhesives. See Section 10.14 for more information. Note 3. These parameters are typical and they are guaranteed by design. |
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