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IW1820 Datasheet(PDF) 4 Page - Dialog Semiconductor

Part # IW1820
Description  15W AccuSwitchTM Quasi-Resonant PWM Controller
PDF  6 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

IW1820 Datasheet(HTML) 4 Page - Dialog Semiconductor

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iW1820
15W AccuSwitchTM Quasi-Resonant PWM Controller
with Integrated Power BJT for 5V Applications
Rev. 0.1 Preliminary
Product Summary
© 2017 Dialog Semiconductor
www.dialog-semiconductor.com
4 of 6
19-Dec-2017
Parameter
Symbol
Value
Units
DC supply voltage range (pin 2, ICC = 20mA max)
VCC
-0.3 to 25.0
V
Continuous DC supply current at VCC pin (VCC = 15V)
ICC
25
mA
ASU output (pin 10)
-0.3 to 19.0
V
VSENSE input (pin 1, IVSENSE ≤ 10mA)
-0.7 to 4.0
V
ISENSE input (pin 9)
-0.3 to 4.0
V
Collector-Emitter breakdown voltage
(Emitter and base shorted together; IC = 1mA, REB = 0Ω)
VCES
800
V
Collector current (Note 1)
IC
4
A
Collector peak current (Note 1) (tp < 1ms)
ICM
8
A
Maximum junction temperature
TJMAX
150
°C
Operating junction temperature
TJOPT
-40 to 150
°C
Storage temperature
TSTG
-55 to 150
°C
Electrostatic Discharge Capability (Human Body Model), JEDEC JS-001-2012
ESD(HBM)
±2000
V
Electrostatic Discharge Capability (Charged Device Model), JESD22-C101
ESD(CDM)
±1000
V
Latch-up test per JESD78D
±100
mA
Notes:
Note 1.
Limited by maximum junction temperature.
Absolute maximum ratings are the parameter values or ranges which can cause permanent damage if exceeded.
5 Absolute Maximum Ratings
6 Thermal Characteristics
Parameter
Symbol
Value
Units
Thermal Resistance Junction-to-Ambient (Note 1)
θJA
TBD
°C/W
Thermal Resistance Junction-to-GND pin (pin 8) (Note 2)
ψJB
TBD
°C/W
Thermal Resistance Junction-to-Collector pin (Note 2)
ψJ-BJT
TBD
°C/W
Thermal Shutdown Threshold (Note 3)
TSD
150
°C
Thermal Shutdown Recovery (Note 3)
TSD-R
100
°C
Notes:
Note 1.
Device is mounted on a JEDEC single-sided board with 100mm2 of 35μm thick copper, in a one-cubic-foot natural
convection chamber with 1W dissipated power.
Note 2.
ψJB [Psi Junction to Board] provides an estimation of the die junction temperature relative to the PCB [Board] surface
temperature. ψJB is measured at the ground pin (pin 3) without using any thermal adhesives. See Section 10.14 for more
information.
Note 3.
These parameters are typical and they are guaranteed by design.



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