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IW1830 Datasheet(PDF) 4 Page - Dialog Semiconductor

Part # IW1830
Description  Off-Line Digital Green-Mode Quasi-Resonant
PDF  6 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

IW1830 Datasheet(HTML) 4 Page - Dialog Semiconductor

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iW1830
Off-Line Digital Green-Mode Quasi-Resonant
PWM Controller Integrated with Power MOSFET
Rev. 1.0
Product Summary
© 2016 Dialog Semiconductor
www.dialog-semiconductor.com
4 of 6
23-August-2016
Absolute maximum ratings are the parameter values or ranges which can cause permanent damage if exceeded.
Parameter
Symbol
Value
Units
DC supply voltage range (pin 1, ICC = 20mA max)
VCC
-0.3 to 25.0
V
Continuous DC supply current at VCC pin (VCC = 15V)
ICC
20
mA
VSENSE input (pin 2, IVsense ≤ 10mA)
-0.7 to 4.0
V
ISENSE input (pin 4)
-0.3 to 4.0
V
Drain-source voltage
VDSS
700
V
Continuous drain current @ TC=25°C
ID
4
A
Continuous drain current @ TC=100°C
2.9
Pulsed drain current (Note 1)
IDM
16
A
Single Pulse Avalanche Energy (starting TJ = 25°C)
EAS
150
mJ
Maximum junction temperature
TJMAX
150
°C
Operating junction temperature
TJOPT
-40 to 150
°C
Storage temperature
TSTG
–55 to 150
°C
Electrostatic Discharge Capability (Human Body Model), JEDEC JS-001-
2012
ESD(HBM)
±4.5
kV
Electrostatic Discharge Capability (Charge Device Model), JEDEC
JESD22-C101
ESD(CDM)
±1.0
kV
Latch-up test per JESD78A
±100
mA
Notes:
Note 1.
Repetitive rating; pulse width limited by maximum junction temperature.
5 Absolute Maximum Ratings
6 Thermal Characteristics
Parameter
Symbol
Value
Units
Thermal Resistance Junction-to-Ambient1
θJA
80
°C/W
Thermal Resistance Junction-to-GND pin (pin 3) 2
ψJB
25
°C/W
Thermal Resistance Junction-to-Drain pin (pin 7 and pin 8) 2
ψJ-MOSFET
35
°C/W
Thermal Shutdown Threshold3
TSD
150
°C
Thermal Shutdown Recovery 3
TSD-R
120
°C
Notes:
Note 1.
Device is mounted on a JEDEC single-sided board with 100mm2 of 35μm thick copper, in a one-cubic-foot natural
convection chamber with 1W dissipated power.
Note 2.
ψJB [Psi Junction to Board] provides an estimation of the die junction temperature relative to the PCB [Board] surface
temperature. ψJ-MOSFET [Psi Junction to Drain pin] provides an estimation of the die junction temperature relative to the
Drain pin [internal MOSFET Drain] surface temperature. ψJB is measured at the ground pin (pin 3) without using any
thermal adhesives. See Section 10.14 for more information.
Note 3.
These parameters are typical and they are guaranteed by design.



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