BI Technologies IRC Welwyn

Solder pad layout (Inch / mm)

BCN 10

P

P1

A

B

X

X1

Y

L

.024

.020

.020 ±.004

.060 ±.004

010 ±.004

.018 ±.004

.020 ±.004

.085 ±.004

0.60

0.50

0.50 ±0.10

1.50 ±0.10

0.25 ±0.15

0.45 ±0.10

0.50 ±0.10

2.15 ±0.10

BCN 21

P

A

B

C

X

Y

W

W1

W2

W3

L

.032 .060 ±.008 .120 ±.008 .016 ±.004 .016 ±.004 .030 ±.004 .012 ±.001

.015 ±.004

.030 ±.004

.030 ±.004 .196 ±.008

0.80 1.20 ±0.20 3.00 ±0.20 0.40 ±0.10 0.40 ±0.10 0.75 ±0.10 0.31 ±0.02

0.38 ±0.10

0.75 ±0.10

0.75 ±0.10 4.98 ±0.20

Y

L

P

A

X

X1

P1

B

P

X

A

B

W1

W2

W3

W

L

C

Y

BCN 10

BCN 21

Thick Film Chip Arrays

BCN Series

02.18

General Note

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All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

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