© TT electronics plc

General Note

TT Electronics reserves the right to make changes in product specification without

notice or liability. All information is subject to TT Electronics’ own data and is

considered accurate at time of going to print.

Issue B

10/2016

Page 2

OPTEK Technology, Inc.

1645 Wallace Drive, Carrollton, TX 75006|Ph: +1 972 323 2200

www.optekinc.com | www.ttelectronics.com

10 V

Operating Temperature Range

-40°C to +70° C

Storage Temperature Range

-40°C to +85° C

Lead Soldering Temperature (1/16 inch (1.6mm) from the case for 5 sec. with soldering iron

(1)

260° C

Input Infrared LED

Input Diode Power Dissipation

(2)

100 mW

Output Photologic® Power Dissipation

(3)

200 mW

Total Device Power Dissipation

(4)

300 mW

Output Photologic®

Voltage at Output Lead (Open Collector Output)

35 V

Diode Forward DC Current

40 mA

Diode Reverse DC Voltage

2 V

OPB930, OPB940 Buffered Totem-Pole

OPB932, OPB942 Inverted Totem-Pole

OPB931, OPB941 Buffered Open-Collector

OPB933 & OPB943 Inverted Open-Collector

Notes:

(1) RMA flux is recommended. Duration can be extended to 10 seconds maximum when flow soldering.

(2) Derate linearly 2.22 mW/°C above 25°.

(3) Derate linearly 4.44 mW/°C above 25°.

(4) Derate linearly 6.66 mW/°C above 25°.

(5) OPB930L/OPB940L series devices are terminated with 0.020” square leads designed for PCBoard mounting.

(6) Methanol and isopropanol are recommended as cleaning agents. Plastic housing is soluble in chlorinated hydrocarbons and ketones.

(7) All parameters tested using pulse technique.