Switch “Wide Gap” Series

OPB900 through OPB913 Series (L, W_Z)

© TT electronics plc

Issue A

09/2016

Page 2

TT Electronics | OPTEK Technology

1645 Wallace Drive, Carrollton, TX 75006|Ph: +1 972 323 2200

www.ttelectronics.com | sensors@ttelectronics.com

General Note

TT Electronics reserves the right to make changes in product specification without

notice or liability. All information is subject to TT Electronics’ own data and is

considered accurate at time of going to print.

Electrical Specifications

DIMENSIONS ARE IN:

INCHES

[ MILLIMETERS]

Color-Pin #

Description

Color-Pin #

Description

Color-Pin #

Description

Color-Pin #

Description

Color-Pin #

Description

Red-1

Anode

Black-2

Cathode

White-3

Blue-4

Output

Green-5

Ground

Storage Temperature

-40° C to +85° C

Operating Temperature

-40° C to +70° C

Lead Soldering Temperature (1/16” (1.6 mm) from case for 5 seconds with soldering iron)

(1)

260° C

Input Infrared LED

DC Forward Diode (LED) Current

40 mA

DC Reverse Diode (LED) Voltage

2 V

Input Diode Power Dissipation

(1)

100 mW

Output Photologic®

10V

Voltage at Output Lead (Open Collector Output version)

35 V

Output Photologic® Power Dissipation

(2)

200 mW

Total Device Power Dissipation

(3)

300 mW

Notes:

(1)

Derate linearly 2.22 mW/°C above 25°C

(2)

Derate linearly 4.44 mW/°C above 25°C

(3)

Derate linearly 6.66 mW/°C above 25°C

(4)

RMA flux is recommended. Duration can be extended to 10 seconds maximum when flow soldering.

(5)

Methanol or isopropanol are recommended as cleaning agents. The plastic housing is soluble in chlorinated hydrocarbons and keytones.